Designed to work with CPU’s up to 73W TDP but with greater cooling efficiency can be attained with efficient case airflow. Pre-applied hi-performance thermal compound ensures clean and easy installation.
• High engineered aluminium heatsink for cost effective cooling
• Bi-ped fins maximise heat dissipation by providing optimal CPU and motherboard VRM cooling
• 3-pin fan connector is used for effective cooling and RPM signal feedback to the motherboard
• Push-pins mounting provides easy and reliable retention
• Intel LGA115X & LGA775 & LGA1200 compatible
• Performance thermal interface is pre-applied
• Total height of only 56.5mm